COB DTP-MCPCB

COB (Chip on Board) is a packaging technology in semiconductor industry. The method is to paste the chip / grain directly on the printed circuit board or substrate. By using wire bonding & epoxy packaging then directly embedded on MCPCB, this practice can extend the lifespan of LED and unified light emission.

Comparing to traditional packing method, COB technology can directly mount multi-chip on substrate, such as COB MCPCB. With this technique, we can reduce lighting areas, materials used, and costs on system’s mechanical & assembly. For example, 20W of high power LED in traditional assembly might need 20 pieces of 1W LED chip packaged in 20 individual LED components then connect individually to a substrate one by one. On the other hand, by using COB technology, we can package 20 pieces of 1W LED together to become a single chip module then using wire bonding to mount on a copper or aluminum MCPCB.

Implementing modularization concept, designer will have more freedom and flexibility by using multi-chips packaged to one single module, with necessary design and combination, to increase overall effectiveness and reduce developing cost substantially. Besides the saving of developing cost, it also increases the luminous output per watt through modularized & packaged LED chip. With the help of MCPCB, it also enhances the heat dissipation of COB package LED. This not only increases light emitting efficiency (luminous per watt increased) of component but also extends lifespan (reliability increased) of component.

By combining DTP(Direct Thermal Path) concept, COB DTP-MCPCB manufactured by Hejin-Angus has much better heat conductivity and dissipation than traditional MCPCB. Its structure and application are as follows.

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At the same time, we can add the cover plate (usually aluminum or glass fiber) on the COB DTP-MCPCB, so that the customer can directly fill glue to package. Its structure and application are as follows:

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If you have any questions, please contact Hejin-Angus for discussion and communication.